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PCMCIA Assemblies


Meritec's 50 and 70 (68+2 end grounds) position PCMCIA Interconnects provide I/O access to card frames.  Each system consists of an I/O card connector mated to a card frame and a ribbon cable assembly.  These interconnect systems can be made to fit various manufacturers' frame configurations.


Specifications

Electrical
  • Current rating 0.75A at 10°C rise over ambient

  • Contact resistance 10 milliohms (max)

  • Dielectric withstanding voltage 500 VRMS AC (min)

  • Insulation resistance 1x10 12 ohms (min)


Mechanical
  • Contact material Nickel Silver Alloy C 77000
    •  
  • Total withdrawal force 2.5 pounds (min)

  • Normal force 100 grams/contact (nominal)

  • Dielectric material liquid crystal polymer plastic

  • Total insertion force 7-10 lbs.

  • Contact finish 20 micro inches (min) Palladium / Nickel
    with Gold flash over 50 micro inches (min) Nickel in contact mating area; 75 micro inches (min) Tin/Lead
    over Nickel on contact tails

Environmental
  • Materials UL rated 94 V-O

  • Temperature rating -55°C to +70°C

Features | Benefits


  • .025" pitch spacing between contacts provides maximum edgeboard density

  • Contacts are insert molded using a patented process, which provides extreme pitch accuracy

  • Dual-beam fork contacts provide a reliable, redundant, two-contact connection with balanced forces

  • Withstands the 10,000 mate/unmate office environment PCMCIA specification (test report available upon request)

  • Liquid crystal polymer plastics provide extreme dimensional stability for reflow solder operations

  • Mass soldered connections provide cost effective terminations and excellent process control

  • Single row contact design with simple termination scheme

  • Available with or without EMI-RFI electrical shielding

  • Cable assemblies are overmolded, providing maximum strain relief using a cost effective, repeatable process


Consult Meritec with inquiries.

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