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Hermaphroditic Connectors

Meritec provides an alternative concept in board to board interconnects - Hermaphroditic Connectors. Each mating half is identical in configuration, eliminating the need for separate male and female parts.  The Hermaphroditic Connector is a high density 0.050" pitch board to board connector. The connector has a dual wipe contact design with 100 grams of normal force that was developed for use in the severe environment of the process control industry. Shallow entry angles on the contacts ensure a smooth insertion force profile to make the connector an excellent candidate for high mating cycle applications. The connectors are available in both 50 and 100 positions in both thru hole and surface mount configurations.

Please see Connectors on Standard Products Page for ordering

Supporting Documents:      

Features | Benefits


  • Contact Resistance: 5 milliohm (max)
  • Dielectric Withstanding Voltage: >1000 VAC (RMS) at sea level
  • Current Rating: 0.75 AMP/contact (continuous)
  • Insulation Resistance: >5 x 1012 ohms at 500 VDC


  • Close pitch .050" centers minimize board space requirements

  • Designed to meet IR or vapor phase reflow requirements

  • Through hole & SMT contact tail configurations available

  • 50 ohm impedance matched connector

  • Precision, high strength molded contacts provide reliability in critical applications

  • Designed for a variety of PC board thicknesses

  • Custom designs available from 10 - 100 positions

  • Available with locating and mounting features

  • Designed with polarization features

  • RoHS compliant


  • Material: U.L. rated 94 V-O
  • Temperature Rating: -40°C to +105°C


  • Plating -
    Mating End: Selectively plated contact surface consisting of flash 30 micro" gold (min) over 50 micro" nickel (min)
    Solder Tails: 5 micro" gold (min) over 50 micro" nickel (min)
  • Insertion Force: 42 grams/contact (nominal)
  • Contact Material: Copper alloy
  • Withdrawal Force: 22 grams/contact (nominal)
  • Normal Force: 100 grams/contact (nominal)
  • Shock & Vibration: MIL standard 1344
    (method 2004 & 2005)
  • Dielectric material: Liquid crystal polymer resin