HERMES Interconnect System

• Close pitch .050” centers minimize board space requirements
• 50 ohm impedance matched connector
• Hermaphroditic contacts eliminate the need for separate male and female connectors
• Designed to meet convection, IR or vapor phase reflow requirements
• Through-hole and SMT contact tail end configurations are available
• Precision, high strength insert molded contacts provide reliability in critical applications
• Available with locating and mounting features
• Designed with polarization features
• RoHS Compliant (available)

Electrical

• Current rating: 3 amp/contact (continuous)
• Contact resistance: 30 milliohm (max)
• Insulation resistance: >5×10 ohms 500 VDC
• Dielectric withstanding voltage: >1000 VAC (RMS) at sea level
• Impedance: 100 ± 5Ohms at 100 psec rise time
• Insertion Loss: < -1dB up to 5GHz for mated plug & receptacle pair
• Crosstalk (NEXT, one aggressor) < -40dB up to 5GHz
• Return Loss: < -20dB up to 5GHz for mated plug & receptacle pair

Mechanical

• Plating – Mating End: Selectively plated contact surface consisting of flash 30 micro” gold (min) over 50 micro” nickel (min) 

  Solder Tails: 5 micro” gold (min) over 50 micro” nickel (min)

• Insertion Force: 42 grams/contact (nominal)
• Contact Material: Copper alloy
• Withdrawal Force: 22 grams/contact (nominal)
• Normal Force: 100 grams/contact (nominal)
• Shock & Vibration: MIL standard 1344 (method 2004 & 2005)
• Dielectric material: Liquid crystal polymer resin

Environmental

• Material: UL recognized 94 V-O
• Temperature Rating: -40°C to +105°C