DESIGNING FOR HARSH ENVIRONMENTS: MATERIALS AND INTERCONNECT CHOICES THAT MATTER
Introduction: When Failure Isn’t an Option
Designing electronic systems for harsh environments requires more than just durable components, it demands a holistic approach to materials, shielding, sealing, and interconnect strategy. In aerospace, defense, oil and gas, rail, and industrial automation, systems are regularly exposed to extreme temperatures, vibration, shock, fluids, and electromagnetic interference. In these cases, failure isn’t merely inconvenient, it can be dangerous or mission-ending.
That’s why the choice of connector matters. Interconnects are the conduits for power and data, and in harsh conditions, they must do more than carry signals. They must endure stress, resist ingress, and protect the signal integrity engineers work so hard to achieve.
At Meritec, we build interconnect systems for some of the world’s most demanding environments. From our Hercules® platform to customized circular assemblies, our solutions are engineered from the materials up to ensure real-world performance.
What Makes an Environment "Harsh"
Not all rugged conditions are the same. Environments may be considered harsh due to a range of physical, chemical, or electromagnetic factors. Vibration and shock are typical in defense and transportation systems. Moisture and particulate ingress are constant threats in outdoor or industrial equipment. High temperatures, or rapid thermal cycling, can challenge material stability and mechanical retention. In some environments, salt, fuels, hydraulic fluids, or corrosive gases present further challenges. Elsewhere, EMI from nearby systems can induce signal distortion or outright failure. A successful interconnect solution must resist all of these influences without degradation of electrical, mechanical, or sealing performance.
The Role of Material Selection in Rugged Connector Design
Every component in a harsh environment connector must be selected for performance under stress. Meritec begins with materials known for their strength, stability, and chemical resistance.
For connector shells, we use high-grade aluminum alloys, stainless steel, or composites, depending on weight and corrosion resistance requirements. These materials can be plated with electroless nickel, zinc-nickel, or passivated for additional protection.
Insulators and inserts are chosen for their dielectric strength and thermal behavior. High-temperature thermoplastics and glass-filled compounds offer mechanical stability without creeping under long-term pressure. For seals, we use elastomers that remain flexible in sub-zero cold or resist degradation in high-heat, fuel-rich zones.
In cable assemblies, jacket materials must survive abrasion, UV exposure, and chemical splash. Polyurethane, Teflon®, and fluorinated ethylene propylene (FEP) are commonly used for their resilience. Internally, conductors are arranged to reduce stress, preserve spacing, and maintain shielding effectiveness.
Connector Geometry and System Integration
Harsh environments often impose physical design constraints. Limited space, curved surfaces, or tight panel densities require connector geometries that fit without compromise. Meritec offers right-angle and straight configurations, low-profile shells, and modular inserts that allow signal and power in a single rugged interface.
Locking mechanisms, strain reliefs, and overmolded features are integrated to prevent disconnection due to vibration or handling. Threaded, bayonet, or push-pull coupling options ensure that mating is secure and repeatable, even in field-deployed applications.
Shielding and EMI Protection
High-speed systems in harsh environments don’t just battle mechanical threats, they must contend with EMI. Without adequate shielding, even the best connector materials can’t prevent signal degradation.
Meritec interconnects feature 360-degree EMI shielding with foil or braid coverage, metal backshells, and grounded interfaces. We carefully manage impedance, grounding strategy, and pair skew to preserve signal integrity in high-speed differential applications. This makes our solutions suitable for systems running USB 3.x, Ethernet, PCIe, SATA, or proprietary serial protocols.
Environmental Sealing: More Than a Gasket
Environmental sealing isn’t just about adding a gasket to a connector. It requires system-level thinking. Seals must maintain pressure under thermal expansion, resist liquid penetration under vibration, and recover after cycles of compression.
Meritec designs for IP67, IP68, or higher sealing levels when needed. That includes mated seals, protective caps, and molded backshells that prevent ingress at the connector-body and cable interface. These solutions are validated through environmental chamber testing, immersion testing, and pressure cycling.
Testing for the Real World
Harsh environment connectors can’t rely on theoretical performance. They must be validated through aggressive testing to industry standards, and often beyond.
Our assemblies are tested for: Vibration and mechanical shock (per MIL-STD specs) Temperature cycling, thermal shock, and high-temperature operation Salt fog, humidity, and fluid exposure Electrical performance: impedance, insertion loss, and continuity.
We also provide visual inspection, X-ray, and pull testing to verify internal conductor integrity and mechanical strength.
Meritec in the Field: Proven Under Pressure
In harsh environments, failure isn’t tolerated. Every connector must prove its worth through performance, resilience, and integration.
Meritec delivers interconnect systems that thrive under pressure, because they’re designed that way from the start. With the right materials, shielding, sealing, and engineering support, your system will perform where others fail.
Conclusion: Materials and Engineering That Endure
If your program demands more than what a datasheet can offer, Meritec is here to help. From custom prototypes to field-deployable solutions, our team will work with you to build a connector system engineered for real-world performance.
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